Our Process
Our Process

We have a modern PCB assembly line, our pick and place machines have AI capabilities and we have 2 points of AI quality control allowing high volumes multi-head automatic SMT placement to provide accurate, reliable and repeatable electronic assemblies. Alongside this, we can produce and prototype smaller quantity orders.
At contract review, we check all the details of your order and analyse your GERBER file and BOM List (Build of materials) and check any details that you need to consider to start the assembly process. We can use our network to find suppliers around the world to collaborate on the supply chain of components considering the worldwide shortage.
With our bespoke automated software, we will identify out of stock or obsolete parts and suggest replacements. As part of the build process, we ensure that we understand the requirements of the build and that we are able to meet your expectations in regards to both delivery time and technical concerns.
The process starts with applying solder paste into the circuit board, which evenly places solder paste on all of the plastic PCB. Solder paste (or solder cream) is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. Before soldering, all PCB boards should print solder paste so that the components can be soldered by the pick & place machines.
We use the automated optical inspection (AOI) machine to see if all of the solder paste is put on properly. This will help us to measure and monitor the quality of your PCB production, and to correct any issue or defects, at any strategic point in the process flow.
The PCB will go to the pick & place machines, where it will scan for fiducials. After that it will align the camera to match. Then, place all of the components. Our machine can place up to 15,000 components per hour. We use a second optical inspection with an operator to check if all the components are in the right place. And insuring you with the top quality.
After the optical inspection, the boards will go to the reflow oven, where it will join the component with the board. The solder paste reflows in the oven and a permanent bond is made between the PCB and the components. After that, the board will be taken for the final optical inspection, to check if all is okay and met with our quality standard.
Reflow temperature profiles are regularly checked with calibrated monitoring equipment.
Once the board is finished, we put it inside an ultrasonic cleaner and it will clean the board thoroughly. Making sure it removes any flux that is left over from the process.
Finished modules are packed into a protective anti-static film and sent to the customer.
We make sure your board has reached your place of destination without any problems. As well as that, every component and production process used to make your board is fully traceable.
Our Machines

Eight Head mounter Pick and Place machine with Vision Camera

Semi-automatic screen
printing machine

Twelve temperature zones
reflow oven